发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce the leakage current by inhibiting the the junction leakage. SOLUTION: A semiconductor device comprises a semiconductor region 103 wherein impurities of one conductivity are incorporated, a gate insulating film 105 formed on the semiconductor region 103, a gate electrode 106 formed on the gate insulating film 105, a low concentration layer 109a formed in a region extending from a principal plane to a first depth of the semiconductor region 103 by injecting first impurities of the opposite conductivity into the semiconductor region 103 by a first dose rate, and a high concentration layer 109b formed in a region extending from the principal plane to a second depth which is shallower than the first depth of the semiconductor region 103 by injecting second impurities of the opposite conductivity into the semiconductor region 103 by a second dosing rate equal to or more than the first dosing rate and not more than 1×10E15/cm<SP>2</SP>. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004281693(A) 申请公布日期 2004.10.07
申请号 JP20030070552 申请日期 2003.03.14
申请人 SEIKO EPSON CORP 发明人 HAGA YASUSHI;HAMA MUNEYOSHI
分类号 H01L29/78;H01L21/265;H01L21/28;H01L21/336;H01L27/148;(IPC1-7):H01L29/78 主分类号 H01L29/78
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