发明名称 |
Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
摘要 |
Integrated circuit (IC) packages employing two-phase microchannel heat exchangers for cooling the packages' IC dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is thermally coupled to a pair of microchannel heat exchangers disposed on opposite sides of the die. Top-side microchannel heat exchangers include a thermal mass having a plurality of open microchannels having wall bases that are hermetically sealed with the top surface of the die, thus forming a plurality of closed microchannels. Alternatively, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. Bottom-side heat exchangers include substrates and chip carriers having microchannels formed therethrough that are thermally coupled to the IC die. The cooling systems employ a plurality of microchannel heat exchangers to cool selected electronic components. |
申请公布号 |
US2004190251(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030404213 |
申请日期 |
2003.03.31 |
申请人 |
PRASHER RAVI;MAHAJAN RAVI |
发明人 |
PRASHER RAVI;MAHAJAN RAVI |
分类号 |
H01L23/40;H01L23/473;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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