发明名称 IMPROVED METAL FRAME FOR ELECTRONIC HARDWARE AND FLAT PANEL DISPLAYS
摘要 A metal frame for electronic hardware and a method of manufacturing such a frame wherein at least a portion of the frame is made of bulk-solidifying amorphous alloys or bulk-solidifying amorphous alloy-composites is provided. The metal frames of the invention are preferably made of bulk-forming amorphous alloys or bulk-forming amorphous alloy-composites having an elastic limit for the metal frame of at least about 1.5%, and preferably greater than about 2.0%, a DeltaTsc of more than 30° C., and at least one of the following properties: a hardness value of about 4 GPA or more, and preferably 5.5 GPA or more; a yield strength of about 2 GPa or more; a fracture toughness of about 10 ksi-sqrt(in) (sqrt:squre root) or more, and preferably 20 ksi sqrt(in) or more; and a density of at least 4.5 g/cc or more.
申请公布号 EP1404884(A4) 申请公布日期 2004.09.29
申请号 EP20020787184 申请日期 2002.06.07
申请人 LIQUIDMETAL TECHNOLOGIES 发明人 PEKER, ATAKAN;JOHNSON, WILLIAM, L.
分类号 B22D11/00;A47B81/00;C21D6/00;C22C14/00;C22C16/00;C22C33/00;C22C45/02;C22C45/10;C22F1/00;H05K5/00;H05K5/02;H05K5/04;(IPC1-7):C22C9/00;C22C45/00 主分类号 B22D11/00
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