Submount for opto-electronic module and packaging method using the same

摘要

A submount for an opto-electronic module for outputting light incident from an opto-electronic device as an electrical signal is provided. The submount includes a dielectric material and an interconnection line. The dielectric material has a polygonal shape including a front face and a bottom face. The interconnection line is attached to the front face and the bottom face of the dielectric material. The interconnection line has a coplanar waveguide structure and is electrically to the opto-electronic device to output signals from the opto-electronic device.