| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming an air gap, especially useful as insulation between metal wires in an electronic device such as an electric wiring structure, within a solid structure. SOLUTION: A metal wire 15 is arranged on a dielectric layer 10 arranged on a base substrate 5. A sacrificial material 20 is arranged to a region between the metal wires 15 and is on the dielectric layer 10. A porous overlay 25 is arranged on the metal wire 15 and the sacrificial material 20. To leave the air gap, the sacrificial material is deteriorated and decomposed by heat, etc., and removed through the overlay. COPYRIGHT: (C)2004,JPO&NCIPI |
