发明名称 METAL MOLD FOR SEALING WITH RESIN, METHOD AND APPARATUS FOR SEALING WITH RESIN USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a low-cost metal mold for sealing with resin by forming a simple mechanism by eliminating the damage to a substrate due to mold clamping and improving a yield by preventing a resin burr, such as, a cull flash, etc., and to provide a method and an apparatus for sealing with the resin using the same. <P>SOLUTION: At least an either one of the center block 56 of the cavity block 53 of a lower mold having a pot 55 provided to fluidize a sealing solid resin 60 and the cull block 25 of the cavity block 23 of an upper mold provided at a position opposed to the pot 55 is slidably supported, and is energized to be protruded in an opposite direction. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004259761(A) 申请公布日期 2004.09.16
申请号 JP20030046104 申请日期 2003.02.24
申请人 DAIICHI SEIKO KK 发明人 NISHIGUCHI MASASHI;HORIIKE MAKOTO;MITANI TAIJI
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56 主分类号 B29C45/26
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