MULTILAYER PRINTED WIRING BOARD

摘要

A multiplayer printed wiring board (100) consisting of one-sided circuit boards (A, B) to house an IC chip (70), and being capable of connecting an IC module (120) to a printed wiring board via a BGA (56) on the rear surface, with the BGAs (56) disposed on the front and rear surfaces and the IC module (120) mounted via a BGA (56) on the front surface. Accordingly, a freedom of configuring an IC module to be mounted is enhanced to allow mounting of various IC modules.