发明名称 |
Soft error resistant semiconductor device |
摘要 |
A semiconductor device comprises a material layer adapted to efficiently stop alpha particles that are substantially generated within a solder bump of a flip chip device. The materials used for stopping the alpha particles are compatible with standard back-end processing and do not degrade adhesion of the solder bump to the remaining substrate. Moreover, a low electrical resistance is maintained and heat dissipation may be improved.
|
申请公布号 |
US2004164409(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20030649049 |
申请日期 |
2003.08.27 |
申请人 |
SCHAMMLER GISELA;BOTTCHER MATHIAS;KUECHENMEISTER FRANK;GEHRE DANIEL;ZSCHECH EHRENFRIED |
发明人 |
SCHAMMLER GISELA;BOTTCHER MATHIAS;KUECHENMEISTER FRANK;GEHRE DANIEL;ZSCHECH EHRENFRIED |
分类号 |
H01L23/485;H01L23/556;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/485 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|