发明名称 |
Latching micro magnetic relay packages and methods of packaging |
摘要 |
A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.
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申请公布号 |
US6778046(B2) |
申请公布日期 |
2004.08.17 |
申请号 |
US20020126291 |
申请日期 |
2002.04.19 |
申请人 |
MAGFUSION INC. |
发明人 |
STAFFORD JOHN;TAM GORDON;SHEN JUN |
分类号 |
B23K31/02;B23K101/40;B81B7/00;H01H1/00;H01H36/00;H01H49/00;H01H50/00;H01H51/24;H01L23/10;(IPC1-7):H01H51/22 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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