| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board having such a high heat radiating property that enables inexpensive perforation by improving the productivity of through hole formation. SOLUTION: After a through hole 105 is formed in a double-sided substrate 107 composed of a thermosetting resin containing an inorganic filler at the forming position of a through hole 108, a multilayered substrate is formed by laminating resin sheets 101 and copper foil 104 upon both surfaces of the substrate 107 and pressing the sheets 101 and foil 104 against the substrate 107 at a temperature lower than the setting temperature of the resin. Then, this multilayered printed wiring board is obtained by forming the through hole 108 while the resin is maintained in a semisolid state, and then, normally setting the resin, and performing copper plating and pattern formation. COPYRIGHT: (C)2004,JPO&NCIPI |
