| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for electronic components capable of improving the reliability of airtight sealing of electronic components without adding a new process. SOLUTION: The package for electronic components is provided with a base 1 provided with a storing recess 11 having mutually opposite front and rear faces and storing the electronic component recessed on the surface, a through hole 12 of which one end is opened in the outside of the storing recess 11 of the surface and the other end is a through hole opened in the rear face, and a conductive pattern 3 formed continuously of at least a part of the rear face, the inside face of the through hole 12 and the inside of the storing recess part 11; and a cover 2 airtightly sealing at least the storing recess part 11. Since the through hole 12 is not opened in the inside of the storing recess 11 and the storing recess part 11 is airtightly sealed with only the cover 2, the reliability of the airtight sealing is improved as compared with a case that one end of the through hole 12 is opened in the inside of the storing recess 11. COPYRIGHT: (C)2004,JPO&NCIPI
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