发明名称 |
PRE-HEATER UNIT AND WAVE SOLDERING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a pre-heater unit to heat a work in advance by a first stage of a solder tank, and a wave soldering device using this pre-heater which are adaptable to lead-free solder. SOLUTION: A fan unit 13 is installed on a lower portion of a heater case 12, and a heater 15 with a fin to heat air fed from the fan unit 13 is installed in a heating chamber 14 in the heater case 12. A radiation plate 17 is installed on an upper portion of the heater case 12. This radiation plate 17 has a large number of holes 16 to feed hot air heated by the heater 15 with the fin to a work W, and the work W is irradiated with far-infrared rays generated by heating the heater 15 with the fin. A collecting means 41 to collect hot air fed to the work W from the radiation plate 17 and circulate the hot air in the fan unit 13 is provided. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004223545(A) |
申请公布日期 |
2004.08.12 |
申请号 |
JP20030012503 |
申请日期 |
2003.01.21 |
申请人 |
TAMURA SEISAKUSHO CO LTD;TAMURA FA SYSTEM CO LTD |
发明人 |
IIJIMA MASAKI;YOSHIDA SHUNICHI |
分类号 |
B23K3/04;B23K1/08;H05K3/34;(IPC1-7):B23K3/04 |
主分类号 |
B23K3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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