| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device along with its manufacturing method where various elements are integrated without any semiconductor substrate. SOLUTION: A layer which is to be peeled and contains an inductor, a capacitor, a resistive element, a TFT element, an embedded wiring, and the like is formed on a substrate without any semiconductor substrate. The layer to be peeled is peeled from the substrate and transferred to a circuit board 100 which is made conductive to a wiring pattern 114 provided on the circuit board 100 using a wire 112 and solder 107, to manufacture a high frequency module or the like. COPYRIGHT: (C)2004,JPO&NCIPI
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