| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a wire which is so shaped as to be hardly disconnected and to provide a highly reliable semiconductor device and its manufacturing method. <P>SOLUTION: A method of manufacturing a semiconductor device comprises a process of carrying out wire bonding with a wire 30 previously provided with a plurality of bent parts 32, and a resin sealing process of sealing up, at least, the wire 30 and a semiconductor chip 20 with resin. Each of the bent parts 32 provided to the wire 30 is so set as to be more bent than the other part of the wire 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
