| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a method of semiconductor device in which quality and manufacturing yield can be improved. SOLUTION: The manufacturing method of semiconductor device is provided with an attaching mechanism, a cutting mechanism 24, and a re-attaching mechanism. The attaching mechanism attaches a first holding member 22 to the backside of a semiconductor wafer 21. The cutting mechanism divides the semiconductor wafer into the wafer pieces by cutting the semiconductor wafer. The re-attaching mechanism re-attaches the holding member by attaching the second holding member 26 to the element forming surface side of the semiconductor wafer under the condition that gaps among the semiconductor element pieces of semiconductor wafer are expanded by extending the first holding member 22 and then peeling the first holding member. Since the holding member is re-attached while the gaps among the semiconductor elements are expanded, interference of semiconductor elements during the transfer thereof can be controlled and the chipping and damage such as a flaw can be reduced. COPYRIGHT: (C)2004,JPO&NCIPI |
