| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electro-optic apparatus by which minute scratches and cracks present on a substrate edge and a cut face can be eliminated by etching without damaging conductors and IC chips, and to provide an electro-optic apparatus and an electronic equipment. SOLUTION: After a liquid crystal panel 1' to be used for an electro-optic apparatus is cut out into a single product size, the substrate edges and the cut faces of a first substrate 10 and a second substrate 20 are subjected to wet etching as in the state of a single product of the liquid crystal panel 1' to eliminate minute scratches and cracks from the substrate edges and the cut faces prior to fabricating ICs. In this process, the wiring part 51, 71, substrate mounting terminal 28, alignment mark 55 and driving IC 13 formed in a protruding region 25 are covered with a protective layer. COPYRIGHT: (C)2004,JPO&NCIPI
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