| 摘要 |
PROBLEM TO BE SOLVED: To provide a high quality pattern wiring board and a device substrate. SOLUTION: A liquid drop spray apparatus is for forming a pattern wiring or a device by spraying a plurality of the liquid drops of a fine particle-containing solution by a spray head 11 having 20μm diameter discharge port to be applied on a substrate 14 to form a pattern on an electric conduction region on the substrate 14, volatilizing a volatile component in the liquid drop pattern after being applied to leave solid matter on the substrate and the electric conduction region. In such a case, when the size of the fine particle is expressed by Dp and the diameter of a discharge port is expressed by Do, the relation of Dp to Do is controlled to be 0.0001≤Dp/Do≤0.01. In the spray head 11, the liquid drop is jetted by the growth action force of film boiling bubbles produced for a moment in the solution and the shape of the liquid in the flying of the liquid drop is made narrow long columnar to have a length 5 times of the diameter and the relative speed of the board 14 to the spray head 11 is controlled to be≤1/3 of the jetting speed of the solution. Further, the narrow long columnar liquid in the flying is flied at a high speed to accompany a plurality of fine drops in the back side. COPYRIGHT: (C)2004,JPO&NCIPI |
