| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of enhancing reflow resistance properties, and to provide a manufacturing method thereof. SOLUTION: There are provided a semiconductor chip 2, a tub mounted on the semiconductor chip 2, a plurality of inner leads disposed surrounding the semiconductor chip 2, a wire for connecting a bonding pad 2a of the semiconductor chip 2 with the inner leads, a sealer for sealing the semiconductor chip 2, a plurality of the wires and the plurality of inner leads with a resin, and a plurality of outer leads, which are integrally linked with each of the inner leads and project externally of the sealer. A recess 2e is formed at an end of a passivation film 2d of the semiconductor chip 2, and the recess 2e is brought into contact with the sealer, whereby the adhesive properties of the sealer to the end of the passivation film 2d can be enhanced, and the occurrence of a separation at an interface between the passivation film 2d and a sealing resin at the end of a main surface of the chip can be prevented, thereby enhancing the reflow resistance properties of the semiconductor device. COPYRIGHT: (C)2004,JPO&NCIPI
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