摘要 |
PROBLEM TO BE SOLVED: To provide a plating method for adequately selectively and economically forming a plating film such as a wire-protecting film, on the surface of wires without corroding the metal wires and others, and to provide a plating apparatus therefor. SOLUTION: This plating method comprises making superfine particles 50 of a metal oxide having photo-electrochemical reactivity carried on the surface to be treated of a substrate W, and while making the surface contact with a plating solution 34, irradiating the surface with light. The superfine particles of the metal oxide having photo-electrochemical reactivity includes, for instance, the ultra-fine particles of TiO<SB>2</SB>. COPYRIGHT: (C)2004,JPO&NCIPI
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