发明名称 Composite ceramic board, method of producing the same, optical/electronic-mounted circuit substrate using said board, and mounted board equipped with said circuit substrate
摘要 A composite ceramic board comprising an insulating board of insulating layers of alumina ceramics and dielectric layers of ceramics having a dielectric constant smaller than that of said insulating layers which are fired as a unitary structure, and metallized wirings of a low-resistance conductor such as of Au, Ag, Cu or Pl formed on the surfaces and inside thereof, and a method of producing the same. The composite ceramic board not only has a large strength and a high thermal conductivity but also exhibits excellent high-frequency characteristics and is suited for use as a high-frequency wiring board. The invention further provides an optical/electronic-mounted circuit substrate using the above board, and a mounted board having the circuit substrate of the invention connected to an electronic circuit formed on a mother board.
申请公布号 US6759740(B2) 申请公布日期 2004.07.06
申请号 US20020113467 申请日期 2002.03.29
申请人 KYOCERA CORPORATION 发明人 ONITANI MASAMITSU;MATSUI TAKESHI;YAMADA SHIGEKI
分类号 H01L23/498;H01L23/66;H05K1/02;H05K1/03;H05K3/46;(IPC1-7):H01L23/12 主分类号 H01L23/498
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