发明名称 |
Composite ceramic board, method of producing the same, optical/electronic-mounted circuit substrate using said board, and mounted board equipped with said circuit substrate |
摘要 |
A composite ceramic board comprising an insulating board of insulating layers of alumina ceramics and dielectric layers of ceramics having a dielectric constant smaller than that of said insulating layers which are fired as a unitary structure, and metallized wirings of a low-resistance conductor such as of Au, Ag, Cu or Pl formed on the surfaces and inside thereof, and a method of producing the same. The composite ceramic board not only has a large strength and a high thermal conductivity but also exhibits excellent high-frequency characteristics and is suited for use as a high-frequency wiring board. The invention further provides an optical/electronic-mounted circuit substrate using the above board, and a mounted board having the circuit substrate of the invention connected to an electronic circuit formed on a mother board.
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申请公布号 |
US6759740(B2) |
申请公布日期 |
2004.07.06 |
申请号 |
US20020113467 |
申请日期 |
2002.03.29 |
申请人 |
KYOCERA CORPORATION |
发明人 |
ONITANI MASAMITSU;MATSUI TAKESHI;YAMADA SHIGEKI |
分类号 |
H01L23/498;H01L23/66;H05K1/02;H05K1/03;H05K3/46;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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