| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-coated pressure-sensitive adhesive tape which, even when non-light-transmitting adherends are stuck to each other through the adhesive tape so that the adhesion interfaces can not be irradiated with light, can be simply and easily peeled off without damaging the adherends by irradiating light from the side direction along the adhesion interfaces, and to provide a method for preparing IC chips using the adhesive tape. SOLUTION: The double-coated pressure-sensitive adhesive tape has a pressure-sensitive adhesive layer which contains a gas generator generating a gas under the irradiation with light and is formed on at least one side of a substrate film comprising a light guide plate. COPYRIGHT: (C)2004,JPO&NCIPI
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