METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF REDUCING CONTACT RESISTANCE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to be capable of minimizing the contact resistance by enhancing the contact area. CONSTITUTION: A first insulating layer(46) is formed on a semiconductor substrate(40) with conductive patterns(43). A plug(49) is formed to contact the substrate through the first insulating layer, wherein the upper part of the plug is protrudent. A second insulating layer(50) is formed on the resultant structure. An opening part is formed to expose the protrudent plug by selectively etching the second insulating layer. A contact pad(53) is formed to contact the protrudent plug.