| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal colloid solution and a conductive film capable of obtaining a high conductive film on a base material poor in thermal resistance by heating at low temperature. SOLUTION: This metal colloid solution comprises a solid content consisting essentially of metal particles and a dispersion medium. The weight loss of the solid content is -1x10<SP>-1</SP>to -1x10<SP>-4</SP>%/°C when performing thermogravimetric analysis from room temperature to 200°C at a temperature rising rate of 10°C/min. A polydispersity index of the diameter of the metal particles calculated by cumulant analysis of a dynamic-light-scattering method is 0.1-0.6. COPYRIGHT: (C)2004,JPO
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