| 摘要 |
The invention relates to an apparatus for encapsulating with plastic lead frames carrying chips, comprising mutually movable mould halves (102, 103) which in the closed position bound a mould cavity for receiving a lead frame, a feed runner connecting onto the mould cavity for supplying encapsulating material and a plunger-cylinder (175) connected onto this feed runner for carrying up encapsulating material under pressure, characterized in that at a distance from the head end of the plunger (175) a peripheral groove (170) is arranged which is connected to the head end by means of at least one flow channel (171). |
