发明名称 Method for recycling a substrate
摘要 The present invention relates to a method for recycling a substrate that has a residue on its surface and a detachment profile resulting from an implantation process. The method includes removing the residue from the substrate to a level substantially equivalent to that of the detachment profile, thus obtaining a substantially uniform planar surface on the substrate, and then polishing the entire surface of the substrate to eliminate defects.
申请公布号 US2004112866(A1) 申请公布日期 2004.06.17
申请号 US20030728343 申请日期 2003.12.03
申请人 MALEVILLE CHRISTOPHE;LETERTRE FABRICE;MAURICE THIBAUT;MAZURE CARLOS;METRAL FREDERIC 发明人 MALEVILLE CHRISTOPHE;LETERTRE FABRICE;MAURICE THIBAUT;MAZURE CARLOS;METRAL FREDERIC
分类号 H01L21/302;B44C1/22;H01L21/00;H01L21/02;H01L21/304;H01L21/306;H01L21/762;(IPC1-7):B44C1/22 主分类号 H01L21/302
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