SEMICONDUCTOR PACKAGE INSPECTING APPARATUS AND INSPECTING METHOD USING THE SAME

摘要

PURPOSE: A semiconductor package inspecting apparatus and an inspecting method using the same are provided to be capable of using a head assembly as an adaptor for reducing inspection cost and improving the efficiency of an inspection process. CONSTITUTION: A semiconductor package inspecting apparatus is provided with a pick and place tool for loading/unloading a semiconductor package, a head assembly(100), and a socket installed at the lower portion of the head assembly for connecting the semiconductor package to a tester. The head assembly includes a package guider(102) installed at the peripheral portion of the pick and place tool for aligning the semiconductor package, and a socket guider(104) for pressing a socket cover and carrying out a pre-alignment process.