发明名称 |
Integrated circuit and production process especially for chip cards has active circuit on substrate surface and deep doped layer to protect against rear interrogation |
摘要 |
An integrated circuit arrangement comprises an active circuit on the upper surface (16) of a semiconductor substrate (12) and a deep-lying doped layer (20) to protect the rear of the device from interrogation or attack. An Independent claim is also included for a production process for the above.
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申请公布号 |
DE10337256(A1) |
申请公布日期 |
2004.06.09 |
申请号 |
DE2003137256 |
申请日期 |
2003.08.13 |
申请人 |
GIESECKE & DEVRIENT GMBH |
发明人 |
DREXLER, HERMANN;LAMLA, MICHAEL |
分类号 |
H01L23/58;(IPC1-7):H01L23/58 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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