发明名称 MULTILAYER BOARD AND ITS PRODUCING PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a multilayer board in which the conductors in respective layers on one side of a core material can not only be connected electrically with each other through the conductors of the core material but also be connected electrically with the conductors in respective layers on the other side. SOLUTION: The multilayer board comprises a glass epoxy core matrial 1 having a copper foil 1b formed on the opposite sides and provided, at desired positions, with through holes for electrically connecting the copper foils on the opposite sides, a first substrate layer 2 having copper foils 21b and 22b being connected electrically with the copper foils on the opposite sides of the core material by the through holes, and a second substrate layer 3 having copper foils 31b and 32b being connected with the copper foils of each first substrate layer by the through holes and connected with the copper foils of the core material through the copper foil of the first substrate layer and through the through holes. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004158671(A) 申请公布日期 2004.06.03
申请号 JP20020323682 申请日期 2002.11.07
申请人 EITO KOGYO:KK 发明人 SEKIMOTO RIICHI;TAKAHASHI TATSUMI;ITO JUNICHI;OWADA HIROYUKI;TANIGUCHI HIROKI;RYUBA KENICHI
分类号 H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
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