| 摘要 |
PROBLEM TO BE SOLVED: To reduce a temperature and pressure at which transferring is carried out, and also to shorten a transferring time. SOLUTION: An electronic component comprises a substrate 1, an adhesive layer 50 supplied on the substrate 1, a transferred pattern formed by transferring, onto the adhesive, conductive paste which is composed of a solvent, a powder conductor, and a binder and with which trenches 31 of an intaglio plate 32 formed of flexible resin are filled up, and a conductor pattern formed by baking the transferred pattern. The conductive paste is cured at a temperature not lower than the volatilization temperature of the solvent and lower than a melting point of the conductive paste, and is one not firmly fixed in the trenches. Hence, there is no need of penetrating the adhesive layer 50 to the conductive paste 42 and curing it. Consequently, the temperature and the pressure at which the conductive paste 42 is transferred to the substrate 1 can be low and the time required for transferring is shortened. COPYRIGHT: (C)2004,JPO
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