发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent hair cracks around the edge of a resin sealed body between terminals. <P>SOLUTION: In a QFN-IC 25 comprising a resin sealed body 21 of a pellet 19, and a plurality of terminals 24 exposed at the circumferential edge part on the lower surface of the resin sealed body 21 where the pellet 19 and the terminals 24 are wire bonded in the resin sealed body 21, a beveled part 22 is formed at the circumferential edge part of the resin sealed body 21 between adjacent terminals 24 and 24. The beveled part 22 is molded simultaneously with the resin sealed body 21 by a protrusion 39 for forming a beveled part. The terminals 24 are cut at close proximity to the circumferential edge part of the resin sealed body 21. Since the beveled part is formed previously, generation of hair crack can be prevented at the circumferential edge part of the resin sealed body between the terminals when they are cut and thereby failure of mounting due to missing of the circumferential edge part starting from the hair crack can be avoided. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004134605(A) 申请公布日期 2004.04.30
申请号 JP20020298308 申请日期 2002.10.11
申请人 RENESAS TECHNOLOGY CORP 发明人 SATO YUKIHIRO;NAGAMINE TORU
分类号 H01L23/28;H01L21/56;(IPC1-7):H01L23/28 主分类号 H01L23/28
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