| 摘要 |
In an electronic component having a lead terminal, for a semiconductor chip, projecting from a molding part for packaging a semiconductor chip, or the like, a main notch for cutting is provided while leaving unnotched parts at the opposite ends thereof before the molding part is formed. After the molding part is formed, the lead terminal is cut at the position of the main notch thus making smaller and fewer burrs occurring on the cutting face. |
