发明名称 SUCTION NOZZLE AND DIE BONDING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a suction nozzle having a thin heater, which attains position recognition with high precision without widely shielding the visual field of an objective lens for position recognition, and to provide die bonding equipment employing the suction nozzle. SOLUTION: A position recognition optical system 40 is arranged above the suction nozzle which is provided with a nozzle tip 1 of a knife ridge shape that narrows as it extends from an upper surface to a lower surface, a long and narrow heater plate 2, a long and narrow heat insulating plate 3, and a collet 4 having a long and narrow support 4a for supporting the foregoings. With this arrangement, an optical path 41 is recured at least passing through the vicinity of the optical axis of the optical system 40 and through windows 5a, 5b of the collet 4 in a plane vertically crossing in the longitudinal direction of the support 4a, the optical path 41 includes therein the support 4a, the heat insulating plate 3, the heater plate 2 and the nozzle tip 1. Thus, the position recognition on a substrate 30 is made possible. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004128233(A) 申请公布日期 2004.04.22
申请号 JP20020290605 申请日期 2002.10.03
申请人 NEC CORP 发明人 KINOSHITA MASAO
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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