| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card for a semiconductor testing device, improving inconveniences in device test with the interference of a power current between a plurality of DUTs in the prove card applicable to a wafer prober device. SOLUTION: This prober interface device for the semiconductor testing device comprises split GNDs split in DUTs or in preset DUT groups and provided for GND layers on a multi-layered substrate having a prove needle, where a plurality of devices to be tested are tested. COPYRIGHT: (C)2004,JPO
|
