| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide electronic equipment whose soldering strength is increased. <P>SOLUTION: In a digital camera 1 that forms an object on a CCD 10 and generates image data for showing the object, the CCD 10 is soldered to a flexible circuit board 20 for packaging and a portion where a connection terminal 10a of the CCD 10 is soldered by solder 30 is formed in a recess 20a in the flexible circuit board 20. <P>COPYRIGHT: (C)2004,JPO</p> |
