| 发明名称 |
Semiconductor device and semiconductor module |
| 摘要 |
A semiconductor chip is electrically connected to the conductive paths (32-34) made of a conductive material having larger crystal growth along Z-axis than that along X and Y axes. An insulating resin coated on the semiconductor chip and the upper surface of the conductive paths is filled into the separation grooves between the conductive paths having exposed back surfaces. An independent claim is included for semiconductor module. |
| 申请公布号 |
EP1191590(A3) |
申请公布日期 |
2004.04.14 |
| 申请号 |
EP20010302974 |
申请日期 |
2001.03.29 |
| 申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
SAKAMOTO, NORIAKI;KOBAYASHI, YOSHIYUKI;SAKAMOTO, JUNJI;MASHIMO, SIGEAKI;OKAWA, KATSUMI;MAEHARA, EIJU;TAKAHASHI, KOUJI |
| 分类号 |
H01L23/28;H01L21/48;H01L21/52;H01L21/60;H01L23/31;H01L23/373;H01L23/495;H01L23/50;H01L25/04;H01L25/18 |
主分类号 |
H01L23/28 |
| 代理机构 |
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