发明名称 CONDUCTIVE PASTE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste exhibiting high conductivity even when the content of silver powder is low. SOLUTION: The conductive paste composition comprises a flaky silver powder A having an average particle size of 3 to 8μm, a specific surface area of 1.5 to 4.0 m<SP>2</SP>/g, and an apparent density of 0.4 to 1.1 g/cm<SP>3</SP>, a flaky silver powder B having an average particle size of 3 to 10μm, an specific surface area of 0.6 to 1.2 m<SP>2</SP>/g, and an apparent density of 1.5 to 2.1 g/cm<SP>3</SP>, and a resin. The conductive paste composition contains the flaky silver powder A of 30 to 95 pts. wt., taking the total weight of the flaky silver powders A and B as 100 parts. The composition contains the flaky silver powders A and B in total at 35 to 85 wt% based on a solid component of the conductive paste. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004111057(A) 申请公布日期 2004.04.08
申请号 JP20020267836 申请日期 2002.09.13
申请人 NIPPON PERUNOTSUKUSU KK;FUKUDA METAL FOIL & POWDER CO LTD 发明人 AIZAWA TAKAYUKI;NOMURA KYOJI;TAKIGAWA AKIO;KAJITA OSAMU;SHIMABAYASHI MASATO;NISHIDA MOTONORI
分类号 C08K7/00;C08L101/00;H01B1/00;H01B1/22;(IPC1-7):H01B1/22 主分类号 C08K7/00
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