PROCESS FOR MANUFACTURING MOUNTING BOARD AND SURFACE MOUNTING CRYSTAL OSCILLATOR

摘要

PROBLEM TO BE SOLVED: To provide a process for manufacturing a mounting board in which productivity is enhanced by containing an IC chip thereby accelerating miniaturization, and to provide a bonding type surface mounting crystal oscillator.

SOLUTION: A surface mounting board containing an IC chip bonded to the bottom face of a crystal oscillator in order to manufacture a surface mounting crystal oscillator is manufactured by containing the IC chip in a recess defined by a bottom wall and a frame wall, filling the recess with resin for protecting the IC chip, and then cutting off at least one side of the frame wall. The mounting board is bonded to the bottom face of the crystal oscillator thus manufacturing the surface mounting crystal oscillator.

COPYRIGHT: (C)2004,JPO