发明名称 WALL WATERPROOF STRUCTURE AND WATERPROOF TYPE ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce the number of components, improve assembling property and realize cost reduction by manufacturing a metal mold of a waterproof connector at a low cost within a short period of time required for the delivery. SOLUTION: The waterproof type electronic apparatus comprises a cabinet 1 of the electronic apparatus, a hole 16 for leading a wire 6 into the cabinet 1, a fitting plate 7 for fitting the wire 6 to the cabinet 1, a hot-melt resin 11 to integrally form the fitting plate 7 and wire 6 and to realize waterproof structure of the hole 16, and a pressure-bonding fixing tool 13 for fitting the fitting plate 7 to the cabinet 1. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004111595(A) 申请公布日期 2004.04.08
申请号 JP20020271055 申请日期 2002.09.18
申请人 TDK CORP 发明人 KANEKO KOJI;YAKUWA ATSUSHI
分类号 H05K7/00;H01R13/74;H05K5/02;H05K5/06;(IPC1-7):H05K5/06 主分类号 H05K7/00
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