Elektronisches Bauelement-Modul und Verfahren zu dessen Herstellung

摘要

The invention relates to a connection-substrate for at least one electronic component. Said substrate comprises a flat substrate body in whose flat surface internal contact projections (3) are recessed by partial removal or deformation (2, 8), for the flip-chip contacting rod of a component or, optionally, external contact projections (9) for connection to a printed circuit board. The production of said contact-projections in a hot stamping method or by means of laser removal enables very small projections to be produced in a narrower grid than current chip-connections.