发明名称 METHOD FOR MANUFACTURING LAMINATED ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a simplified method for manufacturing a laminated piezoelectric device wherein trenches are steadily formed in a single process. <P>SOLUTION: In the method for manufacturing a laminated electronic device, the process of laminating a device body 23 comprises a step for laminating a thermolytic dispersible material sheet 13 on a sheet laminate 7, wherein internal electrode patterns 3 are sandwiched between a pair of ceramic green sheets 1, 5; a step for forming through holes 9 in the sheet laminate 7 by punching by forming dies 14 and for filling the through holes 9 with a lamellar dispersible material 11, simultaneously; a step for peeling the dispersible material sheet 13 from the sheet laminate 7; a step for laminating a plurality of sheet laminates 7 with their positions alternately displaced; and a step for cutting the laminates and for forming, on their opposite side faces, trenches 21 filled with the lamellar dispersible materials 11 in every other layer of the internal electrode patterns 3. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004095592(A) 申请公布日期 2004.03.25
申请号 JP20020250781 申请日期 2002.08.29
申请人 KYOCERA CORP 发明人 SETOGUCHI TAKESHI
分类号 H01L41/22;H01L41/083;H01L41/187;H01L41/23;H01L41/293;H01L41/297;H01L41/338;H01L41/339 主分类号 H01L41/22
代理机构 代理人
主权项
地址