| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip capacitor having a large capacitance in an inexpensive small size by enhancing the yield, and to provide its manufacturing method. SOLUTION: The chip capacitor 10 having a pair of first electrodes 12 and 12a on both faces of a dielectric porcelain substrate 11 has a reinforcing member 14 joined with conductive solder 13 on one side of the first electrodes 12 and 12a, and a second electrode 15 conducted with one side of the first electrodes 12 and 12a on the outer peripheral exposed surface of the reinforcing member 14. In addition, the dielectric porcelain substrate 11 and/or the reinforcing member 14 may be square pillars or columns. Furthermore, the outer shape size of the reinforcing member 14 in a planar view may be equal to or less than the outer shape size of the dielectric porcelain substrate 11. In addition, the dielectric porcelain substrate 11 and the reinforcing member 14 may be joined with a low melting point metal solder having conductivity, and furthermore a thickness of the dielectric porcelain substrate 11 may be 0.2 mm or less. COPYRIGHT: (C)2004,JPO
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