发明名称 COOLING DEVICE, ELECTRONIC EQUIPMENT, ACOUSTIC DEVICE, AND METHOD OF MANUFACTURING COOLING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a cooling device of high cooling performance and high flexibility, an electronic equipment, an acoustic device, and a method of manufacturing the cooling device. <P>SOLUTION: The cooling device 1 is provided with an evaporator 2 for cooling a cooled object, and a condenser 3 for radiating heat generated in cooling with the evaporator 2, to the outside. A gas phase passage 4 and a liquid phase passage 5 which are pipes formed of fluorocarbon resin to allow an operating fluid to flow through, are connected between the evaporator 2 and the condenser 3 to circulate the operating fluid. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004085186(A) 申请公布日期 2004.03.18
申请号 JP20030165805 申请日期 2003.06.10
申请人 SONY CORP 发明人 SOTOZAKI MINEHIRO;KATOU GOUSAKU;OMI MOTOSUKE;YAJIMA TAKASHI;MAKINO TAKUYA
分类号 F25D9/00;F28D15/02;G06F1/20;H01L23/427;H05K7/20 主分类号 F25D9/00
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