| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition having a low viscosity, quick curability, high storage stability, high mountability, high reliability and good mechanical properties and applicable as a liquid sealing material for electronic materials. SOLUTION: The liquid epoxy resin composition comprises an epoxy resin and a curing agent, wherein the epoxy resin contains 40-60 wt.% of a bisphenol-type epoxidized product, 0-60 wt.% of a bivalent aromatic alcohol-type epoxidized product and 0-60 wt.% of a trivalent aromatic alcohol-type epoxidized product( wherein, the bivalent aromatic alcohol-type epoxidized product and the trivalent aromatic alcohol-type epoxidized product totaling 40-60 wt.% ), being≤1 eq/kg in hydroxy group concentration and≤900 ppm in total chlorine content. The viscosity of this liquid epoxy resin composition at 25°C is≤5 Pa.s. COPYRIGHT: (C)2004,JPO
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