| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape where a substrate crack does not occur by preventing bending stress in a radial direction to a center from an outer periphery of the semiconductor substrate from being added to the semiconductor substrate when a peeling tape is stuck to an adhesive tape, the peeling tape is pulled, and the adhesive tape is peeled from the semiconductor substrate, and to provide a peeling method of the adhesive tape. SOLUTION: In the adhesive tape 101, first adhesive layers 103a and 103b are formed in first base materials 102a and 102b. The tape 101 is divided into two without a gap by a division line (cut line) 104 which is extended substantially along the middle of width of the band-like tape. In the peeling method, the semiconductor substrate 6 is vacuum-adsorbed onto an adsorption stage 8. The peeling tape 13 is stuck to the center from the outer periphery of the semiconductor substrate 6 in a direction vertical to the division line (break) 104 of the adhesive tape 101, and the peeling tape 13 is pulled and peeled obliquely upward toward the outer periphery from the center of the semiconductor substrate 6. COPYRIGHT: (C)2004,JPO
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