| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding paste excellent in workability and thermal conductivity. SOLUTION: The die bonding paste containing (A) an epoxy resin, (B) a curing agent and (C) silver powder as essential ingredients has (C) the silver powder of a specific surface area (SA) of not more than 0.57 m<SP>2</SP>/g and tap density (TD) of 4.0 to 7.0g/cm<SP>3</SP>, and its total content to be not less than 75 weight percent of the total weight of (A) the epoxy resin, (B) the curing agent and (C) the silver powder. COPYRIGHT: (C)2004,JPO |
