| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely obtain insulating resin layers having required thicknesses and ideal flatness without receiving any influence upon the formed states of through holes formed through a board nor increasing the number of steps. <P>SOLUTION: In a laminated resin wiring board 11, the board 12 having the through holes 15 is used as a core material. On both main surfaces 13 and 14 of the board 12, insulating resin layers 21 and 22 and wiring layers 31 and 32 are formed. At the time of manufacturing a laminated resin wiring board, insulating resin layers 21 and 22 having thicknesses larger than a required one are formed on the main surfaces 13 and 14 of the board 12, by laminating and press-fixing film-like insulating resin materials 93 and 94 upon and to the main surfaces 13 and 14. Simultaneously, the through holes 15 are filled up. Then through holes 25 are formed through the resin packing material 23 filling up the through holes 15. In addition, blocking bodies 29 are formed by packing a hole filling-up material 96 in the through holes 25. Thereafter, the insulating resin layers 21 and 22 are flattened together with the blocking bodies 96 by removing the surfaces of the layers 21 and 22 until the thicknesses of the layers 21 and 22 become a required one. <P>COPYRIGHT: (C)2004,JPO</p> |
