DEVICE AND METHOD FOR MOUNTING ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To enable a board to be properly heated when an electronic part is mounted on the board in a reduced-pressure environment.

SOLUTION: An electronic part mounting apparatus is equipped with a chamber 11 where the board 91 and the electronic part 92 are loaded, and FAB irradiation devices 161 and 164 which irradiate the board 91 on a stage and the electronic part 92 held by a mounting head 14 with a fast atom beam. Furthermore, a laser unit 162 irradiating the board 91 with a laser beam is additionally provided. The laser beam emitted from the laser unit 162 irradiates the board 91 while the board 91 and the electronic part 92 are irradiated with the fast atom beam. By this setup, the board 91 can be sufficiently and quickly heated in a decompressed environment.

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