CONTROLLER, CONTROLLING METHOD, HEAT TREATING DEVICE AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To execute the temperature control of a body to be heated with high real time performance and high precision under the consideration of the response delay of a heat source. SOLUTION: This heat treating device 1 is provided with a heating device 2 for heating a semiconductor substrate, and a controller 3 for controlling the temperature of the semiconductor substrate for the heating device 2. A controller 3 is provided with a pre-filter 4, a feed-forward control unit 5, a feedback control unit 6, a subtractor 8, and an adder 7. The feed-forward control unit 5 is configured of the inverse system of the heating device 2. The feed-forward control unit 5 receives a target temperature TREFas an input from the pre-filter 4, and calculates a supply power quantity PFF. The feedback controller 6 receives a temperature differenceΔT between a measured temperature Tmand a target temperature TREFof the semiconductor substrate as an input from the subtractor 8, and calculates a correction valueΔP. The adder 7 adds the supply power value PFFinputted from the feed-forward control unit 5 and the correction valueΔP, and supplies the value of a supply power value PINto the heating device 2. COPYRIGHT: (C)2004,JPO