| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technique for reducing defective contact between a bump of an LCD driver and a probe needle of a measuring instrument. <P>SOLUTION: On an insulating film 3 covering a semiconductor device on the main surface of a semiconductor substrate, a pad 4 consists of a metallic film of the same layer as the top layer wiring. On the upper layer of the pad 4, a passivation film 5 is deposited. On the passivation film 5, an opening part 6 having at least a chevron edge projecting in a slide-stopping direction of the probe needle 7 of the measuring instrument in a view from an upper surface, and a dimple 9b reflecting the level difference of the opening part, are formed on the upper surface of the bump 9. There are a plurality of contacts of the probe needle 7 and the bump 9. <P>COPYRIGHT: (C)2004,JPO</p> |
