| 摘要 |
PURPOSE: A stacked semiconductor package and a stacking method are provided to reduce noise between an upper and a lower semiconductor package by using a printed circuit film for connecting corresponding lead lines with a ground electrode and a chip selection line. CONSTITUTION: A plurality of lead lines(15) are closely contacted with a side portion of an upper semiconductor package(10) by bending the lead lines to the side portion. The length of a chip selection lead line(15-1) is shorter than the length of other lead lines(15). A lower semiconductor package(30) is adhered on a lower end portion of the upper semiconductor package(10). A plurality of lead lines(35) of the lower semiconductor package(30) correspond to the lead lines(15) except for the chip selection lead line(15-1). A printed circuit film(50) is inserted between the upper semiconductor package(10) and the lower semiconductor package(30). A chip selection line(51) and a ground electrode(55) are printed on the printed circuit film(50).
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